Specific Process Knowledge/Lithography/DUVStepperLithography: Difference between revisions
Appearance
| Line 104: | Line 104: | ||
*Bottom Anti Reflection Coating (BARC) [http://www.brewerscience.com/products/arc/dry-etch-arc-coatings/248nm-products/duv42s DUV 42S-6] [[Media:Datasheet_DUV42S.pdf |Datasheet DUV42S-6]]. | *Bottom Anti Reflection Coating (BARC) [http://www.brewerscience.com/products/arc/dry-etch-arc-coatings/248nm-products/duv42s DUV 42S-6] [[Media:Datasheet_DUV42S.pdf |Datasheet DUV42S-6]]. | ||
*Positive DUV resist for | *Positive DUV resist for spin coating in 600-300nm thickness range [[Media:M230Y_PSM_annular_130C_PEB.pdf|KRF M230Y]]. | ||
*Positive DUV resist for | *Positive DUV resist for spin coating in 1600-800nm thickness range [[Media:M35G_Danchip_intro.pdf|KRF M35G]]. | ||
*Negative DUV resist for | *Negative DUV resist for spin coating in 1400-800nm or diluted with EC Solvent in 1:1 in 400-200nm thickness range [[Media:UVN2300.pdf|UVN2300-0.8]]. | ||
===Standard processes=== | ===Standard processes=== | ||