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Specific Process Knowledge/Lithography/DUVStepperLithography: Difference between revisions

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*Bottom Anti Reflection Coating (BARC) [http://www.brewerscience.com/products/arc/dry-etch-arc-coatings/248nm-products/duv42s DUV 42S-6] [[Media:Datasheet_DUV42S.pdf |Datasheet DUV42S-6]].
*Bottom Anti Reflection Coating (BARC) [http://www.brewerscience.com/products/arc/dry-etch-arc-coatings/248nm-products/duv42s DUV 42S-6] [[Media:Datasheet_DUV42S.pdf |Datasheet DUV42S-6]].
*Positive DUV resist for spinning in 600-300nm thickness range [[Media:M230Y_PSM_annular_130C_PEB.pdf|KRF M230Y]].
*Positive DUV resist for spin coating in 600-300nm thickness range [[Media:M230Y_PSM_annular_130C_PEB.pdf|KRF M230Y]].
*Positive DUV resist for spinning in 1600-800nm thickness range [[Media:M35G_Danchip_intro.pdf|KRF M35G]].
*Positive DUV resist for spin coating in 1600-800nm thickness range [[Media:M35G_Danchip_intro.pdf|KRF M35G]].
*Negative DUV resist for spinning in 1400-800nm or diluted with EC Solvent in 1:1 in 400-200nm thickness range [[Media:UVN2300.pdf|UVN2300-0.8]].
*Negative DUV resist for spin coating in 1400-800nm or diluted with EC Solvent in 1:1 in 400-200nm thickness range [[Media:UVN2300.pdf|UVN2300-0.8]].


===Standard processes===
===Standard processes===