Jump to content

Specific Process Knowledge/Thin film deposition/Deposition of Silver: Difference between revisions

← Older editNewer edit →
VisualWikitext
Paphol (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
912 edits
Paphol (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
912 edits
Line 27: Line 27:
! Thermal evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]])
! Thermal evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]])
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Physimeca|Physimeca]])
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Physimeca|Physimeca]])
! Sputter evaporation ([[Specific Process Knowledge/Thin film deposition/Multisource PVD|PVD co-sputter/evaporation]])
! Sputter evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]])
! Sputter evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]])
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]])
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]])
Line 37: Line 36:
| Thermal deposition of Ag
| Thermal deposition of Ag
| E-beam deposition of Ag
| E-beam deposition of Ag
| Sputter deposition of Ag
| Sputter deposition of Ag
| Sputter deposition of Ag
| Sputter deposition of Ag
| Sputter deposition of Ag
Line 48: Line 46:
|RF Ar clean  
|RF Ar clean  
|
|
|RF Ar clean
|RF Ar clean  
|RF Ar clean  
|RF Ar clean  
|RF Ar clean  
Line 59: Line 56:
|10Å to 0.5µm (0.5µm not on all wafers)
|10Å to 0.5µm (0.5µm not on all wafers)
|10Å to 2000Å  
|10Å to 2000Å  
|10Å to about 5000Å
|10Å to about 3000Å  
|10Å to about 3000Å  
|10Å to about 1000Å  
|10Å to about 1000Å  
Line 70: Line 66:
|1Å/s to 10 Å/s
|1Å/s to 10 Å/s
|1 to 10Å/s
|1 to 10Å/s
|Dependent on [[/Sputter rates for Ag PVD co-sputter/evaporation|process parameters]].
|Depending on [[/Sputter Ag in Wordentec|process parameters]] (also written in the logbook).
|Depending on [[/Sputter Ag in Wordentec|process parameters]] (also written in the logbook).
|Dependent on process parameters.
|Dependent on process parameters.
Line 89: Line 84:
*12x4" wafers or
*12x4" wafers or
*12x2" wafers  
*12x2" wafers  
|
*1x 2" wafer or
*1x 4" wafers or
*Several smaller pieces


|
|
Line 134: Line 125:
* Pyrex wafers  
* Pyrex wafers  


|
* Silicon
* Silicon oxide
* Silicon (oxy)nitride
* Photoresist
* PMMA
* Mylar
* SU-8
* Metals
|
|
* Silicon  
* Silicon  
Line 173: Line 154:
|
|
|Only very thin layers.
|Only very thin layers.
|
|
|
|
|
Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Silver"