Specific Process Knowledge/Thin film deposition/Deposition of Alumina: Difference between revisions
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==Deposition of aluminium oxide== | ==Deposition of aluminium oxide== | ||
Aluminium oxide (Alumina, Al<sub>2</sub>O<sub>3</sub> ) can be deposited by use of ALD (atomic layer deposition) or by a sputter technique in the [[Specific Process Knowledge/Thin film deposition/Lesker|Lesker Sputter System | Aluminium oxide (Alumina, Al<sub>2</sub>O<sub>3</sub> ) can be deposited by use of ALD (atomic layer deposition) or by a sputter technique in the [[Specific Process Knowledge/Thin film deposition/Lesker|Lesker Sputter System]]. During the sputter deposition oxygen is added to the chamber resulting in aluminium oxide on the sample | ||
*[[Specific_Process_Knowledge/Thin_film_deposition/ALD_Picosun_R200/Al2O3_deposition_using_ALD|Al<sub>2</sub>O<sub>3</sub> deposition using ALD]] | *[[Specific_Process_Knowledge/Thin_film_deposition/ALD_Picosun_R200/Al2O3_deposition_using_ALD|Al<sub>2</sub>O<sub>3</sub> deposition using ALD]] | ||
*[[Specific Process Knowledge/Thin film deposition/Lesker|Lesker Sputter System]] | *[[Specific Process Knowledge/Thin film deposition/Lesker|Lesker Sputter System]] | ||
==Comparison of the methods for deposition of Alumium Oxide== | ==Comparison of the methods for deposition of Alumium Oxide== | ||