Specific Process Knowledge/Thin film deposition/Deposition of Tin: Difference between revisions

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*Up to 1x4" wafers
*Up to 1x4" wafers
*smaller pieces
*small pieces
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Revision as of 09:01, 19 September 2016

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Tin can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.


E-beam evaporation (Alcatel)
General description E-beam deposition of Sn
Pre-clean RF Ar clean
Layer thickness 10Å to 1µm*
Deposition rate 2Å/s to 15Å/s
Pre-clean RF Ar clean
Batch size
  • Up to 1x4" wafers
  • small pieces
Allowed materials
  • Silicon
  • Silicon oxide
  • Silicon (oxy)nitride
  • Photoresist
  • PMMA
  • Mylar
  • SU-8
  • Metals
Comment

* For thicknesses above 200 nm permission is required.

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