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Specific Process Knowledge/Thin film deposition/Deposition of NiV: Difference between revisions

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!  
!  


! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Multisource PVD|PVD co-sputter/evaporation]])
|Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker|Sputter-System Lesker]])
<span style="color:Red">This machine will be decommissioned soon</span>
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker|Sputter-System Lesker]])
|-  
|-  


|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
! General description
! General description
| Sputter deposition of NiV
| Sputter deposition of NiV
| Sputter deposition of NiV
|-
|-
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! Pre-clean
! Pre-clean


|RF Ar clean
|RF Ar clean
|RF Ar clean
|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
! Layer thickness
! Layer thickness


|About 10Å to 4000Å
|About 10Å to 5000Å
|About 10Å to 5000Å
|-
|-
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! Deposition rate
! Deposition rate


|Depending on process parameters.
|Depending on process parameters.
|Depending on process parameters.


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! Batch size
! Batch size


|
*12x2" wafers or
*12x4" wafers or
*4x6" wafers
|
|
*Pieces or
*Pieces or
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|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
! Allowed substrates
! Allowed substrates
 
|   
* Silicon wafers
* Quartz wafers
* Pyrex wafers
|
|
* Silicon wafers
* Silicon wafers
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|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
!Allowed materials
!Allowed materials
|
 
* Silicon
* Silicon oxide
* Silicon (oxy)nitride
* Photoresist
* PMMA
* Mylar
* SU-8
* Metals
|
|
* Silicon
* Silicon
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! Comment
! Comment


| Sputter target with NiV composition: Ni/V 93/7%
| Sputter target with NiV composition: Ni/V 93/7%
| Sputter target with NiV composition: Ni/V 93/7%
|-
|-

Revision as of 09:23, 19 September 2016

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Sputtering of Nickel Vanadium

Nickel Vanadium may be sputter deposited in either Sputter-system (Lesker) or PVD co-sputter/evaporation


In the chart below you can compare the different deposition equipment.

Sputter deposition (Sputter-System Lesker)
General description Sputter deposition of NiV
Pre-clean RF Ar clean
Layer thickness About 10Å to 5000Å
Deposition rate Depending on process parameters.
Batch size
  • Pieces or
  • 1x4" wafer or
  • 1x6" wafer
Allowed substrates
  • Silicon wafers
  • Quartz wafers
Allowed materials
  • Silicon
  • Silicon oxide
  • Silicon nitride
  • Silicon (oxy)nitride
  • Photoresist
  • PMMA
  • Mylar
  • SU-8
  • Metals
  • Carbon
Comment Sputter target with NiV composition: Ni/V 93/7%
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