Specific Process Knowledge/Lithography/Pretreatment: Difference between revisions
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!style="background:silver; color:black;" align="center" width="60"|Purpose | !style="background:silver; color:black;" align="center" width="60"|Purpose | ||
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|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
* HMDS priming only | * HMDS priming only | ||
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* HMDS priming only | * HMDS priming only | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
* HMDS priming only | * HMDS priming only | ||
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* HMDS priming only | * HMDS priming only | ||
* HMDS priming and spin coating | * HMDS priming and spin coating | ||
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!style="background:silver; color:black;" align="center" width="60"|Priming chemical | !style="background:silver; color:black;" align="center" width="60"|Priming chemical | ||
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!style="background:silver; color:black" align="center" valign="center" rowspan="1"|Performance | !style="background:silver; color:black" align="center" valign="center" rowspan="1"|Performance | ||
|style="background:LightGrey; color:black"|Contact angle | |style="background:LightGrey; color:black"|Contact angle | ||
|style="background:WhiteSmoke; color:black | |style="background:WhiteSmoke; color:black"| | ||
standard recipe 82° (on SiO<sub>2</sub>) | standard recipe 82° (on SiO<sub>2</sub>) | ||
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* Boron Glass: xx° | * Boron Glass: xx° | ||
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60° - 90°; standard recipe 82° (on SiO<sub>2</sub>) | 60° - 90°; standard recipe 82° (on SiO<sub>2</sub>) | ||
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!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameters | !style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameters | ||
|style="background:LightGrey; color:black"|Process temperature | |style="background:LightGrey; color:black"|Process temperature | ||
|style="background:WhiteSmoke; color:black | |style="background:WhiteSmoke; color:black"| | ||
150°C | 150°C | ||
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xx°C | xx°C | ||
|style="background:WhiteSmoke; color:black | |style="background:WhiteSmoke; color:black"| | ||
50°C | 50°C | ||
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|style="background:LightGrey; color:black"|Process time | |style="background:LightGrey; color:black"|Process time | ||
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32.5 minutes | 32.5 minutes | ||
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xx minutes | xx minutes | ||
|style="background:WhiteSmoke; color:black | |style="background:WhiteSmoke; color:black"| | ||
3 min / wafer | 3 min / wafer | ||
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!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates | !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates | ||
|style="background:LightGrey; color:black"|Substrate size | |style="background:LightGrey; color:black"|Substrate size | ||
|style="background:WhiteSmoke; color:black | |style="background:WhiteSmoke; color:black"| | ||
* 50 mm wafers | * 50 mm wafers | ||
* 100 mm wafers | * 100 mm wafers | ||
* 150 mm wafers | * 150 mm wafers | ||
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|style="background:WhiteSmoke; color:black | * 50 mm wafers | ||
100 mm wafers | * 100 mm wafers | ||
* 150 mm wafers | |||
|style="background:WhiteSmoke; color:black"| | |||
* 100 mm wafers | |||
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* 100 mm wafers | |||
* 150 mm wafers | |||
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