Specific Process Knowledge/Etch/Etching of Silicon Oxide: Difference between revisions
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*Anisotropic etch: vertical sidewalls | *Anisotropic etch: vertical sidewalls | ||
*Premarily for III-V samples | |||
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*Anisotropic etch: vertical sidewalls | *Anisotropic etch: vertical sidewalls | ||
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*DUV resist | *DUV resist | ||
*E-beam resist | *E-beam resist | ||
*Silicon | *Silicon | ||
*Silicon Nitride | *Silicon Nitride | ||
*Metals if they cover less than 5% of the wafer area | *Metals if they cover less than 5% of the wafer area | ||
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*DUV resist | *DUV resist | ||
*E-beam resist | *E-beam resist | ||
*Silicon | *Aluminum | ||
*Silicon | |||
*Silicon Nitride | *Silicon Nitride | ||
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*DUV resist | *DUV resist | ||
*E-beam resist | *E-beam resist | ||
*Silicon | *Silicon | ||
*Silicon Nitride | *Silicon Nitride | ||
*Aluminium | *Aluminium | ||
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*Quartz/fused silica | *Quartz/fused silica | ||
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* | *GaAs, GaN, InP, with epitaxial layers | ||
* | *Aluminum | ||
*Silicon | *Silicon | ||
*Silicon Oxide | *Silicon Oxide | ||