Specific Process Knowledge/Etch/Etching of Silicon Oxide: Difference between revisions
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![[Specific Process Knowledge/Etch/Wet Silicon Oxide Etch (BHF)|Wet Silicon Oxide etch (BHF/HF)]] | ![[Specific Process Knowledge/Etch/Wet Silicon Oxide Etch (BHF)|Wet Silicon Oxide etch (BHF/HF)]] | ||
![[Specific Process Knowledge/Etch/RIE (Reactive Ion Etch)|RIE2 (Reactive Ion Etch)]] | ![[Specific Process Knowledge/Etch/RIE (Reactive Ion Etch)|RIE2 (Reactive Ion Etch)]] | ||
![[Specific Process Knowledge/Etch/III-V RIE |III-V RIE]] | |||
![[Specific Process Knowledge/Etch/AOE (Advanced Oxide Etch)|AOE (Advanced Oxide Etch)]] | ![[Specific Process Knowledge/Etch/AOE (Advanced Oxide Etch)|AOE (Advanced Oxide Etch)]] | ||
![[Specific Process Knowledge/Etch/ICP Metal Etcher|ICP metal]] | ![[Specific Process Knowledge/Etch/ICP Metal Etcher|ICP metal]] | ||
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*Isotropic etch | *Isotropic etch | ||
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*Anisotropic etch: vertical sidewalls | |||
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*Anisotropic etch: vertical sidewalls | *Anisotropic etch: vertical sidewalls | ||
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*Silicon Nitride | *Silicon Nitride | ||
*Metals if they cover less than 5% of the wafer area | *Metals if they cover less than 5% of the wafer area | ||
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*Photoresist | |||
*DUV resist | |||
*E-beam resist | |||
*Silicon Oxide | |||
*Silicon Nitride | |||
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*Photoresist | *Photoresist | ||
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*Process dependent | *Process dependent | ||
*Tested range: ~20nm/min - ~120nm/min | *Tested range: ~20nm/min - ~120nm/min | ||
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*Process dependent | |||
*Tested range: ~1nm/min - ~30nm/min | |||
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*Process dependent | *Process dependent | ||
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*<nowiki>#</nowiki>1 100mm wafer (or smaller with carrier) | *<nowiki>#</nowiki>1 100mm wafer (or smaller with carrier) | ||
*<nowiki>#</nowiki>1 150mm wafer (only when set up for 150mm) | *<nowiki>#</nowiki>1 150mm wafer (only when set up for 150mm) | ||
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*As many small samples as can be fitted on the 100mm carrier. | |||
*<nowiki>#</nowiki>1 100mm wafer (or smaller with carrier) | |||
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*As many small samples as can be fitted on a 100mm wafer | *As many small samples as can be fitted on a 100mm wafer | ||
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*Other metals if they cover less than 5% of the wafer area (ONLY RIE2!) | *Other metals if they cover less than 5% of the wafer area (ONLY RIE2!) | ||
*Quartz/fused silica | *Quartz/fused silica | ||
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* | |||
* | |||
*Silicon | |||
*Silicon Oxide | |||
*Silicon Nitride | |||
*Silicon Oxynitride | |||
*Photoresist | |||
*DUV resist | |||
*E-beam resist | |||
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*[http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=115 Please take a look in the cross contamination sheet in LabManager for details] | *[http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=115 Please take a look in the cross contamination sheet in LabManager for details] | ||