Specific Process Knowledge/Etch/Etching of Silicon Oxide: Difference between revisions
Appearance
| Line 8: | Line 8: | ||
*[[/SiO2 etch using RIE1 or RIE2|SiO2 etch using RIE2]] | *[[/SiO2 etch using RIE1 or RIE2|SiO2 etch using RIE2]] | ||
*[[/SiO2 etch using AOE|SiO2 etch using AOE]] | *[[/SiO2 etch using AOE|SiO2 etch using AOE]] | ||
*[[Specific_Process_Knowledge/Etch/ICP_Metal_Etcher/silicon_oxide| | *[[Specific_Process_Knowledge/Etch/ICP_Metal_Etcher/silicon_oxide|SiO2 etch using ICP metal]] | ||
*[[Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300|IBE/IBSD Ionfab 300]] | *[[Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300|IBE/IBSD Ionfab 300]] | ||
*[[/SiO2 etch using Plasma Asher|SiO2 etch using Plasma Asher (isotropic)]] | *[[/SiO2 etch using Plasma Asher|SiO2 etch using Plasma Asher (isotropic)]] | ||