Specific Process Knowledge/Etch/Etching of Silicon Oxide: Difference between revisions
| Line 58: | Line 58: | ||
*Silicon Oxide | *Silicon Oxide | ||
*Silicon Nitride | *Silicon Nitride | ||
*Metals if they cover less than 5% of the wafer area | *Metals if they cover less than 5% of the wafer area | ||
| | | | ||
*Photoresist | *Photoresist | ||