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Specific Process Knowledge/Lithography/Pretreatment: Difference between revisions

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!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment  
!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment  
|style="background:WhiteSmoke; color:black" align="center"|<b>[[Specific_Process_Knowledge/Lithography/Pretreatment#HMDS oven|HMDS oven]]</b>
|style="background:WhiteSmoke; color:black" align="center"|<b>[[Specific_Process_Knowledge/Lithography/Pretreatment#HMDS oven|HMDS oven]]</b>
|style="background:WhiteSmoke; color:black" align="center"|<b>[[Specific_Process_Knowledge/Lithography/Pretreatment#HMDS oven|HMDS oven 2]]</b>
|style="background:WhiteSmoke; color:black" align="center"|<b>[[Specific_Process_Knowledge/Lithography/Coaters#Spin Track 1 + 2|Spin Track 1 + 2]]</b>
|style="background:WhiteSmoke; color:black" align="center"|<b>[[Specific_Process_Knowledge/Lithography/Coaters#Spin Track 1 + 2|Spin Track 1 + 2]]</b>
|style="background:WhiteSmoke; color:black" align="center"|<b>[[Specific_Process_Knowledge/Lithography/Coaters#gamma_uv|Gamma UV]]</b>
|-
|-
!style="background:silver; color:black;" align="center" width="60"|Purpose  
!style="background:silver; color:black;" align="center" width="60"|Purpose  
|style="background:LightGrey; color:black"|
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* HMDS priming
* HMDS priming
|
Coming soon.


|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* HMDS priming only
* HMDS priming only
* HMDS priming and spin coating
* HMDS priming and spin coating
|
Coming soon.
|-
|-
!style="background:silver; color:black;" align="center" width="60"|Priming chemical  
!style="background:silver; color:black;" align="center" width="60"|Priming chemical  
|style="background:LightGrey; color:black"|
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
|style="background:WhiteSmoke; color:black" align="center" colspan="4"|
hexamethyldisilizane (HMDS)
hexamethyldisilizane (HMDS)
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="1"|Performance
!style="background:silver; color:black" align="center" valign="center" rowspan="1"|Performance
|style="background:LightGrey; color:black"|Contact angle
|style="background:LightGrey; color:black"|Contact angle
|style="background:WhiteSmoke; color:black" align="center"|
|style="background:WhiteSmoke; color:black" align="center"|
standard recipe 82° (on SiO<sub>2</sub>)
standard recipe 82° (on SiO<sub>2</sub>)
|
|style="background:WhiteSmoke; color:black" align="center"|
|style="background:WhiteSmoke; color:black" align="center"|
60° - 90°; standard recipe 82° (on SiO<sub>2</sub>)
60° - 90°; standard recipe 82° (on SiO<sub>2</sub>)
|
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameters
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameters
|style="background:LightGrey; color:black"|Process temperature
|style="background:LightGrey; color:black"|Process temperature
|style="background:WhiteSmoke; color:black" align="center"|
|style="background:WhiteSmoke; color:black" align="center"|
150°C
150°C
|
|style="background:WhiteSmoke; color:black" align="center"|
|style="background:WhiteSmoke; color:black" align="center"|
50°C
50°C
|
|-
|-
|style="background:LightGrey; color:black"|Process time
|style="background:LightGrey; color:black"|Process time
|style="background:WhiteSmoke; color:black" align="center"|
|style="background:WhiteSmoke; color:black" align="center"|
32.5 minutes
32.5 minutes
|
|style="background:WhiteSmoke; color:black" align="center"|
|style="background:WhiteSmoke; color:black" align="center"|
3 min / wafer
3 min / wafer
|
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Substrate size
|style="background:LightGrey; color:black"|Substrate size
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* 100 mm wafers
* 100 mm wafers
* 150 mm wafers
* 150 mm wafers
|
|style="background:WhiteSmoke; color:black" align="center"|
|style="background:WhiteSmoke; color:black" align="center"|
100 mm wafers
100 mm wafers
|
|-
|-
| style="background:LightGrey; color:black"|Allowed materials
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black" align="center"|
|style="background:WhiteSmoke; color:black" align="center"|
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Film or pattern of all but Type IV and resist/polymer
Film or pattern of all but Type IV and resist/polymer
|
|style="background:WhiteSmoke; color:black" align="center"|
|style="background:WhiteSmoke; color:black" align="center"|
Silicon and glass wafers
Silicon and glass wafers


Film or pattern of all types
Film or pattern of all types
|
|-
|-
|style="background:LightGrey; color:black"|Batch
|style="background:LightGrey; color:black"|Batch
|style="background:WhiteSmoke; color:black" align="center"|
|style="background:WhiteSmoke; color:black" align="center"|
1 - 25, multiple batches possible
1 - 25, multiple batches possible
|
|style="background:WhiteSmoke; color:black" align="center"|
|style="background:WhiteSmoke; color:black" align="center"|
1 - 25
1 - 25
|
|-  
|-  
|}
|}
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