Specific Process Knowledge/Bonding: Difference between revisions
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|Wet chemical cleaning, [[Specific Process Knowledge/Wafer cleaning/IMEC|IMEC]]. | |Wet chemical cleaning, [[Specific Process Knowledge/Wafer cleaning/IMEC|IMEC]]. | ||
|Cleaning by N2. | |Cleaning by N2. | ||
|-valign="top" | |||
|'''IR alignment''' | |||
|Double side polished wafers. | |||
|Double side polished wafers. | |||
|Not relevant. | |||
|- | |- | ||
|} | |} | ||