Specific Process Knowledge/Bonding/Fusion bonding: Difference between revisions
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===Bonding procedure=== | ===Bonding procedure=== | ||
*'''Remember to use double side polished wafers for alingment.''' | |||
*Clean the wafers with [[Specific Process Knowledge/Wafer cleaning/IMEC|IMEC]] clean. | *Clean the wafers with [[Specific Process Knowledge/Wafer cleaning/IMEC|IMEC]] clean. | ||
*Transport the wafers to the bonder in a clean box. | *Transport the wafers to the bonder in a clean box. | ||