Specific Process Knowledge/Bonding/Fusion bonding: Difference between revisions
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*Clean the wafers with [[Specific Process Knowledge/Wafer cleaning/IMEC|IMEC]] clean. | *Clean the wafers with [[Specific Process Knowledge/Wafer cleaning/IMEC|IMEC]] clean. | ||
*Transport the wafers to the bonder in a clean box. | |||
*Clean the chuck with ethanol. | |||
*Clean the glass top with ethanol. | |||
*CLean the graphite electrode with ethanol. | |||
*Clean the bond glass with Ethanol. | |||
*Place the wafers in the alinger with a clean tweezer. | |||
*Align the wafers | |||
*Place the chuck and graphite electrode in the chamber. | |||
*Close the chamber. | |||
*Turn the µm screw on top of the chamber to set the desired stack hight. | |||