Specific Process Knowledge/Lithography/EBeamLithography/JBX9500Manual: Difference between revisions

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 |[[File:4inchAl.jpg|190px]]  [[File:IMG_6439.jpg|190px]]
 |- align="center"
-| chip Al/Cu cassette and a close-up of slot 3B (12 mm) || 2" Ti cassette; wafer orientation is flat-down || 2" Al cassette; wafer orientation is flat-up || 4" Ti cassette; position A, B, and C; wafer orientation is flat-down || 4" Al cassette; position D, and E; wafer orientation is flat-down
+| chip Al/Cu (position A - D) cassette and a close-up of slot 3B (12 mm) || 2" Ti cassette; position A - F; wafer orientation is flat-down || 2" Al cassette; position A - F; wafer orientation is flat-up || 4" Ti cassette; position A, B, and C; wafer orientation is flat-down || 4" Al cassette; position D, and E; wafer orientation is flat-down
 |}