Specific Process Knowledge/Lithography/EBeamLithography/JBX9500Manual: Difference between revisions
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| [[File:IMG_6433.jpg|170px]] [[File:IMG_6434.jpg|170px]] | | [[File:IMG_6433.jpg|170px]] [[File:IMG_6434.jpg|170px]] | ||
| [[File:IMG_6436.jpg|170px]] [[File:IMG_6437.jpg|170px]] | | [[File:IMG_6436.jpg|170px]] [[File:IMG_6437.jpg|170px]] | ||
|[[File: | |[[File:4inchAl.jpg|170px]] [[File:IMG_6439.jpg|170px]] | ||
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| chip Al/Cu cassette and a close-up of slot 3B (12 mm) || 2" Ti cassette; wafer orientation is flat-down || 2" Al cassette; wafer orientation is flat-up || 4" Ti cassette; wafer orientation is flat-down || 4" Al cassette; wafer orientation is flat-down | | chip Al/Cu cassette and a close-up of slot 3B (12 mm) || 2" Ti cassette; wafer orientation is flat-down || 2" Al cassette; wafer orientation is flat-up || 4" Ti cassette; wafer orientation is flat-down || 4" Al cassette; wafer orientation is flat-down | ||