Specific Process Knowledge/Bonding/Fusion bonding: Difference between revisions
New page: ==Fusion Bonding== Fusion bonding is a weaker bond between e.g. two clean Si wafers. It is absolutely necessary for the wafers to be very clean and to be annealed at 1000<math>\rm{^o}</ma... |
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Try and put a fusion bonding as early in a process sequence as possible, since during annealing is not possible to have any kind of metals on your wafer. Furthermore the thermal budget could drive dopants further into the wafer than wanted. | Try and put a fusion bonding as early in a process sequence as possible, since during annealing is not possible to have any kind of metals on your wafer. Furthermore the thermal budget could drive dopants further into the wafer than wanted. | ||
===Bonding procedure=== | |||
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