Specific Process Knowledge/Lithography/mrEBL6000

Resist	Polarity	Manufacturer	Comments	Technical reports	Developer	Rinse	Remover	Process flows (in docx-format)
mr EBL 6000.1	Positive	MicroResist	Standard negative resist	mrEBL6000 processing Guidelines.pdf‎	mr DEV	IPA	mr REM	Process_Flow_mrEBL6000.docx‎

3 week project on mrEBL6000 by William Tiddi

mrEBL6000 was studied April 2015 by William Tiddi; the report can be found here‎.

Spin Curve

The thickness is measured on VASE Ellipsometer using a simple Cauchy model for a transparent polymer on Si. The measurements are performed at one incidence angle (70 degrees) only.

9 points on each 4" wafer has been measured; the standard deviation thus representing the homogeinity of the film on the 4" wafers.

MicroResist mr EBL 6000. Spin coated on Spin Coater: Manual LabSpin A-5, WILTID, 2015. Softbake 3 min @ 110 degC.
Spin Speed [rpm]	Thickness [nm]	St Dev
2000	103	0.5
3000	88	0.4
4000	78	0.4
5000	71	0.7
6000	68	0.5
7000	66	0.6

MicroResist mr EBL 6000 diluted 1:1 in anisole. Spin coated on Spin Coater: Manual LabSpin A-5, WILTID, 2015. Softbake 3 min @ 110 degC.
Spin Speed [rpm]	Thickness [nm]	St Dev
2000	50	0.2
3000	42	0.5
4000	38	0.5
5000	34	0.3
6000	32	0.3
7000	32	0.3

Contrast Curve

The contrast curve is measured on lines 100 nm in width, exposed with doses in the range of 6-63 µC/cm2. After exposure, the sample has been post-exposure baked 5 min @ 110 degree C. Development is performed with mr-DEV 600 in 40s followed by an IPA rinse 60s. These measurements are performed by WILTID April 2015.