Specific Process Knowledge/Lithography/mrEBL6000: Difference between revisions

Revision as of 10:52, 6 July 2016

Resist	Polarity	Manufacturer	Comments	Technical reports	Developer	Rinse	Remover	Process flows (in docx-format)
mr EBL 6000.1	Positive	MicroResist	Standard negative resist	mrEBL6000 processing Guidelines.pdf‎	mr DEV	IPA	mr REM	Process_Flow_mrEBL6000.docx‎

3 week project on mrEBL6000 by William Tiddi

mrEBL6000 was studied April 2015 by William Tiddi; the report can be found File:Report (2).pdf here

Spin Curve

The thickness is measured on VASE Ellipsometer using a simple Cauchy model for a transparent polymer on Si. The measurements are performed at one incidence angle (70 degrees) only.

9 points on each 4" wafer has been measured; the standard deviation thus representing the homogeinity of the film on the 4" wafers.

MicroResist mr EBL 6000. Spin coated on Spin Coater: Manual LabSpin A-5, WILTID, 2015. Softbake 3 min @ 110 degC.
Spin Speed [rpm]	Thickness [nm]	St Dev
2000	103	0.5
3000	88	0.4
4000	78	0.4
5000	71	0.7
6000	68	0.5
7000	66	0.6

MicroResist mr EBL 6000 diluted 1:1 in anisole. Spin coated on Spin Coater: Manual LabSpin A-5, WILTID, 2015. Softbake 3 min @ 110 degC.
Spin Speed [rpm]	Thickness [nm]	St Dev
2000	50	0.2
3000	42	0.5
4000	38	0.5
5000	34	0.3
6000	32	0.3
7000	32	0.3

@@ Line 29: / Line 29: @@
 |}
+== 3 week project on mrEBL6000 by William Tiddi ==
+mrEBL6000 was studied April 2015 by William Tiddi; the report can be found [[:File:Report (2).pdf here]]
 == Spin Curve ==