Specific Process Knowledge/Lithography/mrEBL6000: Difference between revisions

Revision as of 10:48, 6 July 2016

Resist	Polarity	Manufacturer	Comments	Technical reports	Spinner	Developer	Rinse	Remover	Process flows (in docx-format)
mr EBL 6000.1	Positive	MicroResist	Standard negative resist	mrEBL6000 processing Guidelines.pdf‎	Manual Spinner 1 (Laurell), Spin Coater Labspin	mr DEV	IPA	mr REM	Process_Flow_mrEBL6000.docx‎

Process Flow

Test of mr EBL 6000.1; a negative e-beam resist from MicroResist.

Equipment	Process Parameters	Comments
Pretreatment
4" Si wafers	1 min @ 110 degC, hotplate
Spin Coat
Spin Coater Manual, LabSpin, A-5	mr EBL 6000.1 E-beam resist 60 sec at various spin speed. Acceleration 2000 s-2, softbake 3 min at 110 deg Celcius	Disposal pipette used; clean by N2-gun before use. Use approximately 1.5 ml per 4" wafer, never use a pipette twice.
Characterization
Ellipsometer VASE B-1	9 points measured on 100 mm wafer	ZEP program used; measured at 70 deg only
E-beam Exposure
JEOL 9500 E-beam writer, E-1	Dosepattern 15nm - 100nm, dose 120-280 muC/cm2	Virtual chip mark height detection (CHIPAL V1) used in corner of every dose array
Development
Fumehood, D-3	60 sec in 60 sec rinse in IPA, N2 Blow dry	Gentle agitation while developing. After developing, wafer is immersed in beaker with IPA, subsequently blow dried with N2 gun.
Characterization
Zeiss SEM Supra 60VP, D-3	2-3 kV, shortest working distance possible, chip mounted with Al tape	The wafers are diced into smaller pieces and sputter coated with Pt at DTU CEN before SEM inspection; please contact Ramona Valentina Mateiu for further information.

Spin Curve

The thickness is measured on VASE Ellipsometer using a simple Cauchy model for a transparent polymer on Si. The measurements are performed at one incidence angle (70 degrees) only.

9 points on each 4" wafer has been measured; the standard deviation thus representing the homogeinity of the film on the 4" wafers.

MicroResist mr EBL 6000. Spin coated on Spin Coater: Manual LabSpin A-5, WILTID, 2015. Softbake 3 min @ 110 degC.
Spin Speed [rpm]	Thickness [nm]	St Dev
2000	103	0.5
3000	88	0.4
4000	78	0.4
5000	71	0.7
6000	68	0.5
7000	66	0.6

MicroResist mr EBL 6000 diluted 1:1 in anisole. Spin coated on Spin Coater: Manual LabSpin A-5, WILTID, 2015. Softbake 3 min @ 110 degC.
Spin Speed [rpm]	Thickness [nm]	St Dev
2000	50	0.2
3000	42	0.5
4000	38	0.5
5000	34	0.3
6000	32	0.3
7000	32	0.3

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 !colspan="3"|MicroResist mr EBL 6000 diluted 1:1 in anisole. Spin coated on Spin Coater: Manual LabSpin A-5, WILTID, 2015. Softbake 3 min @ 110 degC.
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