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Specific Process Knowledge/Lithography/CSAR: Difference between revisions

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=== Dark Erosion ===
=== Dark Erosion ===


Dark erosion is measured on a un-exposed 4" wafer spin coated with CSAR 6200.18. The resist thickness has been measured by VASE Ellipsometer before development, and after 3 minutes, 13 minutes, and 30 minutes of development in AR 600 546.
Dark erosion has been measured on a un-exposed 4" wafer spin coated with CSAR 6200.18 to a thickness of approximately 549 nm. The resist thickness has been measured by VASE Ellipsometer before development, and after 3 minutes, 13 minutes, and 30 minutes of development in AR 600 546.


The graphs shows teh measured thicknesses; the errorbars represents the standard deviations from the ellipsometric measurements.
The graphs shows teh measured thicknesses; the errorbars represents the standard deviations from the ellipsometric measurements.