Specific Process Knowledge/Etch/DRIE-Pegasus/ProcessA/PrA-1: Difference between revisions
No edit summary |
No edit summary |
||
| Line 96: | Line 96: | ||
| C04047.05 | | C04047.05 | ||
| | | | ||
[[file:C04047.05 132.jpg|150px|frameless ]] | |||
[[file:C04047.05 133.jpg|150px|frameless ]] | |||
[[file:C04047.05 134.jpg|150px|frameless ]] | |||
[[file:C04047.05 135.jpg|150px|frameless ]] | |||
[[file:C04047.05 136.jpg|150px|frameless ]] | |||
[[file:C04047.05 137.jpg|150px|frameless ]] | |||
[[file:C04047.05 138.jpg|150px|frameless ]] | |||
[[file:C04047.05 124.jpg|150px|frameless ]] | |||
[[file:C04047.05 125.jpg|150px|frameless ]] | |||
[[file:C04047.05 126.jpg|150px|frameless ]] | |||
[[file:C04047.05 127.jpg|150px|frameless ]] | |||
[[file:C04047.05 128.jpg|150px|frameless ]] | |||
[[file:C04047.05 129.jpg|150px|frameless ]] | |||
[[file:C04047.05 130.jpg|150px|frameless ]] | |||
[[file:C04047.05 131.jpg|150px|frameless ]] | |||
|- | |- | ||
|} | |} | ||
Revision as of 15:36, 15 June 2016
| Date | Substrate Information | Process Information | SEM Images | |||
|---|---|---|---|---|---|---|
| Wafer info | Exposed area | Conditioning | Recipe | Wafer ID | ||
| 2/5-2016 | 4" Travka20 Wafer | 20 % Si | 3 minute TDESC clean | PrA-1, 80 cycles or 14:40 minutes | C03991.02 |
|
| 2/5-2016 | 4" Travka20 Wafer | 20 % Si | 3 minute TDESC clean | PrA-1, 80 cycles or 14:40 minutes | C03991.05 |
|
| 3/6-2016 | 4" Travka20 Wafer | 20 % Si | 3 minute TDESC clean | PrA-1, 80 cycles or 14:40 minutes | C04047.02 |
|
| 3/6-2016 | 4" Travka20 Wafer | 20 % Si | 3 minute TDESC clean | PrA-1, 80 cycles or 14:40 minutes | C04047.05 |
|
