Specific Process Knowledge/Etch/Etching of Bulk Glass: Difference between revisions

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 |'''General description'''
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-*Isotropic etch
+*40% pre-mixed HF
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-*Isotropic etch
+*40% pre-mixed HF
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 |'''Etch rate'''
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-*~75 nm/min (Thermal oxide) in BHF
+*~700 nm/min (patterned silica, slow stirring)
-*~90 nm/min (Thermal oxide) in SIO Etch
+*~800 nm/min (non-patterned silica, slow stirring)
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-*Typically 40-120 nm/min can be increased or decreased by using other recipe parameters.
+*~3,9 800 nm/min Typically 40-120 nm/min can be increased or decreased by using other recipe parameters.
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