Specific Process Knowledge/Etch/Etching of Bulk Glass: Difference between revisions

@@ Line 24: / Line 24: @@
 {| border="2" cellspacing="0" cellpadding="4" align="center"
 !
-! Wet Silicon Oxide etch (BHF and SIO Etch (wetting agent))
+! Fused silica
-! RIE
+! Borofloat glass
 |- valign="top"
 |'''General description'''
@@ Line 31: / Line 31: @@
 *Isotropic etch
 |
-*Anisotropic etch: vertical sidewalls
+*Isotropic etch
 |
 |-valign="top"
 |'''Possible masking materials'''
 |
-*Photoresist
+*LPCVD silicon
-*Silicon nitride
 |
-*Photoresist
+*Sputtered silicon (Alcatel)
-*(Poly)Silicon
-*Aluminium
-*Chromium (ONLY RIE2!)
-*Other metals that covers less the 5% of the wafer area (ONLY RIE2!)
 |
 |- valign="top"