Specific Process Knowledge/Etch/Etching of Bulk Glass: Difference between revisions
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* Bake-out at 250 C (>2,5 hours) | * Bake-out at 250 C (>2,5 hours) | ||
* Plasma ashing | * Plasma ashing | ||
* Sputter-deposit in Alcatel: Power: 550W, Ar-pressure: 10<math>^{-2}</math> mbar | * Sputter-deposit in Alcatel: Power: 550W, Ar-pressure: 10<math>^{-2}</math> mbar (base pressure: 10<math>^{-6}</math> mbar | ||
40% HF 3µm/min | 40% HF 3µm/min | ||
Beaker | Beaker | ||