Specific Process Knowledge/Etch/DRIE-Pegasus/processA/PrA-0: Difference between revisions
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|- | |||
| 3/6-2016 | |||
| 4" Travka20 Wafer | |||
| 20 % Si | |||
| 3 minute TDESC clean | |||
| PrA-0, 80 cycles or 14:40 minutes | |||
| C04047.04 | |||
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