Specific Process Knowledge/Lithography/EBeamLithography: Difference between revisions
| Line 99: | Line 99: | ||
* Bring the (main) bottle of resist to the fumehood. Carefully unscrew the lid of the resist bottle. '''If necessary, wipe the thread of the resist bottle before you pour resist into your own bottle'''; dried resists may sit on the thread and be transferred into your bottle (or worse into the large resist bottle) when pouring. | * Bring the (main) bottle of resist to the fumehood. Carefully unscrew the lid of the resist bottle. '''If necessary, wipe the thread of the resist bottle before you pour resist into your own bottle'''; dried resists may sit on the thread and be transferred into your bottle (or worse into the large resist bottle) when pouring. | ||
* Clean all bottles on the outside with anisole or IPA, let them fume off in the fumehood. Clean the measurement beaker as well. | * Clean all bottles on the outside with anisole or IPA, let them fume off in the fumehood. Clean the measurement beaker as well. | ||
When spin coating e-beam resist, you should use a pipette to transfer resist from your bottle to the substrate. If you pour the resist directly from your bottle, you will leave resist in the thread that will soon dry out and leave particles in the resist. | |||
The disposable pipettes need to be thoroughly cleaned with a N2 gun before use. After some trainning, you can obtain particle-free 4" wafers if bottle and pipette (and spin coater) are properly cleaned. | |||
<\br> | |||
== E-beam resists and Process flow == | == E-beam resists and Process flow == | ||