Specific Process Knowledge/Etch/Etching of Bulk Glass: Difference between revisions

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-At Danchip, we have two types of bulk glass substrates: Borosilicate glass (Borofloat) and fused silicate glass which in cleanliness match quartz.
+At Danchip, we have two types of bulk glass substrates: Borosilicate glass (Borofloat 33 (like pyrex)) and fused silicate glass which in cleanliness is similar to quartz. Both types are etched wet in a special set-up placed in a fumehood using a strong HF-solution (isotropic etch).
-Silicon oxide can be etched using either wet chemistry or dry etch equipment. Wet chemistry is mainly used to remove all the oxide on the surface (backside and front side) of a wafer or for isotrotropic etching. Dry etching etches anisotropic. It etches one side of the wafer at a time and can be used to etch structures with several masking materials.
+Masking materials and pre-treatment of the glass surface prior to the deposition of the masking material is a special concern in particular for deep etchings (> 10µm).
 % HF 3µm/min