Specific Process Knowledge/Etch/Etching of Bulk Glass: Difference between revisions
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At Danchip, we have two types of bulk glass substrates: Borosilicate glass (Borofloat) and fused silicate glass which in cleanliness match quartz. | |||
Silicon oxide can be etched using either wet chemistry or dry etch equipment. Wet chemistry is mainly used to remove all the oxide on the surface (backside and front side) of a wafer or for isotrotropic etching. Dry etching etches anisotropic. It etches one side of the wafer at a time and can be used to etch structures with several masking materials. | |||
40% HF 3µm/min | 40% HF 3µm/min | ||
Beaker | Beaker |
Revision as of 09:33, 11 March 2008
At Danchip, we have two types of bulk glass substrates: Borosilicate glass (Borofloat) and fused silicate glass which in cleanliness match quartz.
Silicon oxide can be etched using either wet chemistry or dry etch equipment. Wet chemistry is mainly used to remove all the oxide on the surface (backside and front side) of a wafer or for isotrotropic etching. Dry etching etches anisotropic. It etches one side of the wafer at a time and can be used to etch structures with several masking materials.
40% HF 3µm/min Beaker Maske?
Beskrives en hel process.
Comparison of wet Silicon Oxide etch and dry etches (RIE and AOE) etch for etching of Silicon Oxide
Wet Silicon Oxide etch (BHF and SIO Etch (wetting agent)) | RIE | AOE | |
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General description |
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Possible masking materials |
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Etch rate |
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Batch size |
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Size of substrate |
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Allowed materials |
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