Specific Process Knowledge/Etch/Etching of Bulk Glass: Difference between revisions
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At Danchip, we have two types of bulk glass substrates: Borosilicate glass (Borofloat) and fused silicate glass which in cleanliness match quartz. | |||
Silicon oxide can be etched using either wet chemistry or dry etch equipment. Wet chemistry is mainly used to remove all the oxide on the surface (backside and front side) of a wafer or for isotrotropic etching. Dry etching etches anisotropic. It etches one side of the wafer at a time and can be used to etch structures with several masking materials. | |||
40% HF 3µm/min | 40% HF 3µm/min | ||
Beaker | Beaker | ||