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| image:PegProcessA110cycles.jpg| Process time 20:10 | | image:PegProcessA110cycles.jpg| Process time 20:10 |
| </gallery> | | </gallery> |
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| == Effects on Process A of showerhead change in December 2014 ==
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| The effects of [[Specific Process Knowledge/Etch/DRIE-Pegasus/showerheadchange|changing of the showerhead in December 2014]] was investigated. Patterned wafers were processed before and after and the profile of the etched features were inspected in SEM. Click on the numbers in the 'Runs' column below to see the profiles.
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| {| border="1" cellpadding="1" cellspacing="0" style="text-align:center;"
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| |-
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| ! rowspan="2" width="100"| Recipe
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| ! rowspan="2" width="20"| Name
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| ! rowspan="2" width="20"| Temp.
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| ! colspan="6" | Deposition step
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| ! colspan="7" | Etch step
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| ! colspan="3" | Comments
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| |-
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| ! Time
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| ! Pres.
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| ! C<sub>4</sub>F<sub>8</sub>
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| ! SF<sub>6</sub>
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| ! O<sub>2</sub>
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| ! Coil
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| ! Time
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| ! Pres.
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| ! C<sub>4</sub>F<sub>8</sub>
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| ! SF<sub>6</sub>
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| ! O<sub>2</sub>
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| ! Coil
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| ! Platen
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| ! Showerhead
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| ! Runs
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| ! width="100" | Key words
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| |-
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| ! rowspan="4" | Process A <!-- recipe name -->
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| ! Step1 11 cyc <!-- step -->
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| | rowspan="2" |20 <!-- chiller temp -->
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| ! 4 <!-- dep time -->
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| | 25 <!-- dep pressure -->
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| | 200 <!-- C4F8 flow -->
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| | 0 <!-- SF6 flow -->
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| | 0 <!-- O2 flow -->
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| | 2000 <!-- coil power -->
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| | 7.0 <!-- etch time -->
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| | 25(1.5s) 90>>150 <!-- etch pressure -->
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| | 0 <!-- C4F8 flow -->
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| | 350(1.5s) 550 <!-- SF6 flow -->
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| | 5 <!-- O2 flow -->
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| | 2800 <!-- coil power -->
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| | 120>>140(1.5s) 45 <!-- platen power -->
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| ! rowspan="2" | Old <!-- Showerhead -->
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| | rowspan="2" |[[Specific Process Knowledge/Etch/DRIE-Pegasus/showerheadchange/ProcessA | 1]] <!-- link processes -->
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| | rowspan="2" | <!-- keywords -->
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| |-
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| ! Step2 44 cyc <!-- step -->
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| ! 4 <!-- dep time -->
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| | 25 <!-- dep pressure -->
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| | 200 <!-- C4F8 flow -->
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| | 0 <!-- SF6 flow -->
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| | 0 <!-- O2 flow -->
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| | 2000 <!-- coil power -->
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| | 7.0 <!-- etch time -->
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| | 25(1.5s) 150 <!-- etch pressure -->
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| | 0 <!-- C4F8 flow -->
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| | 350(1.5s) 550 <!-- SF6 flow -->
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| | 5 <!-- O2 flow -->
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| | 2800 <!-- coil power -->
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| | 140(1.5s) 45 <!-- platen power -->
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| |-
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| ! Step1 11 cyc <!-- step -->
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| | rowspan="2" |20 <!-- chiller temp -->
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| ! 4 <!-- dep time -->
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| | 25 <!-- dep pressure -->
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| | 200 <!-- C4F8 flow -->
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| | 0 <!-- SF6 flow -->
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| | 0 <!-- O2 flow -->
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| | 2000 <!-- coil power -->
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| | 7.0 <!-- etch time -->
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| | 25(1.5s) 90>>150 <!-- etch pressure -->
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| | 0 <!-- C4F8 flow -->
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| | 350(1.5s) 550 <!-- SF6 flow -->
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| | 5 <!-- O2 flow -->
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| | 2800 <!-- coil power -->
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| | 120>>140(1.5s) 45 <!-- platen power -->
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| ! rowspan="2" | New <!-- Showerhead -->
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| | rowspan="2" |[[Specific Process Knowledge/Etch/DRIE-Pegasus/showerheadchange/ProcessA | 1]] <!-- link processes -->
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| | rowspan="2" | Profile improved <!-- keywords -->
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| |-
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| ! Step2 44 cyc <!-- step -->
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| ! 4 <!-- dep time -->
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| | 25 <!-- dep pressure -->
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| | 200 <!-- C4F8 flow -->
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| | 0 <!-- SF6 flow -->
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| | 0 <!-- O2 flow -->
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| | 2000 <!-- coil power -->
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| | 7.0 <!-- etch time -->
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| | 25(1.5s) 150 <!-- etch pressure -->
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| | 0 <!-- C4F8 flow -->
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| | 350(1.5s) 550 <!-- SF6 flow -->
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| | 5 <!-- O2 flow -->
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| | 2800 <!-- coil power -->
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| | 140(1.5s) 45 <!-- platen power -->
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| |-
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| |}
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