Specific Process Knowledge/Bonding

Choose bonding method

• Eutectic bonding
• Fusion bonding
• Anodic bonding

Comparing the three bonding methods in the EVG NIL

.	Eutectic bonding	Fusion bonding	Anodic bonding
General description	For bonding two substrates by use of an interphase that makes an eutecticum.	For bonding two identical materials.	For bonding Si and Glass.
Bonding temperature	Depending on the eutecticum 310$^{o}$C to 400Failed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle ^o} C.	Depending on defects 50Failed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle ^o} C to 400$^{o}$C.	Depending on the voltage 300$^{o}$C to 500$^{o}$C Standard is 400$^{o}$C.
Annnealing temperature	No annealing	1000$^{o}$C in the bond furnace C3	No annealing
Materials possible to bond	Bonding of substrates is done by use of the eutectica Au/Si, Au/Sn and Ni/Si	Si/Si, SiO$_{2}$/SiO$_{2}$	Si/Pyrex (glass)
Substrate size	Up to 6" (aligning only possible for 4" and 6")	Up to 6" (aligning only possible for 4" and 6")	Up to 6" (aligning only possible for 4" and 6")
Cleaning	Cleaning by N2.	Wet chemical cleaning, IMEC.	Cleaning by N2.

Choose equipment

• Speedline manual spinner - For spinning of PMMA and Topas
• EVG NIL