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See results in the acceptance report: [[Media:Pegasus_AcceptanceTest.pdf|here]].
See results in the acceptance report: [[Media:Pegasus_AcceptanceTest.pdf|here]].


==Process optimization [[Image:section under construction.jpg|70px]]==
== Effects on Process D of showerhead change in December 2014 ==
''by Frederik Stöhr 2015''
 
The effects of [[Specific Process Knowledge/Etch/DRIE-Pegasus/showerheadchange|changing of the showerhead in December 2014]] was investigated. Patterned wafers were processed before and after and the profile of the etched features were inspected in SEM.
 
Process D is intended to be used for imprinting purposes - that means smooth sidewalls at relatively shallow depths (that means 'not through wafer'). It is therefore natural to exploit the faster switching capability introduced with the new showerhead for this etch process. An improved version of Process D (called Process D4) was found - see the table below.
 
Click on the numbers in the 'Runs' column below to see the profiles.
 
{| border="1" cellpadding="1" cellspacing="0" style="text-align:center;"
|-
! rowspan="2" width="100"| Recipe
! rowspan="2" width="20"| Name
! rowspan="2" width="20"| Temp.
! colspan="6" | Deposition step
! colspan="7" | Etch step
! colspan="3" | Comments
|-
! Time
! Pres.
! C<sub>4</sub>F<sub>8</sub>
! SF<sub>6</sub>
! O<sub>2</sub>
! Coil
! Time
! Pres.
! C<sub>4</sub>F<sub>8</sub>
! SF<sub>6</sub>
! O<sub>2</sub>
! Coil
! Platen
! Showerhead
! Runs
! width="100" | Key words
|-
! rowspan="7" | Process D    <!-- recipe name -->
! Original <!-- step -->
| 0      <!-- chiller temp -->
! 2      <!-- dep time -->
| 20      <!-- dep pressure -->
| 150      <!-- C4F8 flow -->
| 0      <!-- SF6 flow -->
| 0    <!-- O2 flow -->
| 2000      <!-- coil power -->
| 2.4      <!-- etch time -->
| 26      <!-- etch pressure -->
| 0      <!-- C4F8 flow -->
| 275      <!-- SF6 flow -->
| 5      <!-- O2 flow -->
| 2500      <!-- coil power -->
| 35      <!-- platen power -->
! Old      <!-- Showerhead -->
| [[Specific Process Knowledge/Etch/DRIE-Pegasus/showerheadchange/ProcessD/original | 1]]      <!-- link processes -->
|  <!-- keywords -->
|-
! Original <!-- step -->
| 0      <!-- chiller temp -->
! 2      <!-- dep time -->
| 20      <!-- dep pressure -->
| 150      <!-- C4F8 flow -->
| 0      <!-- SF6 flow -->
| 0    <!-- O2 flow -->
| 2000      <!-- coil power -->
| 2.4      <!-- etch time -->
| 26      <!-- etch pressure -->
| 0      <!-- C4F8 flow -->
| 275      <!-- SF6 flow -->
| 5      <!-- O2 flow -->
| 2500      <!-- coil power -->
| 35      <!-- platen power -->
! New      <!-- Showerhead -->
| [[Specific Process Knowledge/Etch/DRIE-Pegasus/showerheadchange/ProcessD/original | 1]]      <!-- link processes -->
|  <!-- keywords -->
|-
! New Process D <!-- step -->
| 0      <!-- chiller temp -->
! 1      <!-- dep time -->
| 20      <!-- dep pressure -->
| 150      <!-- C4F8 flow -->
| 0      <!-- SF6 flow -->
| 0    <!-- O2 flow -->
| 2000      <!-- coil power -->
! 3      <!-- etch time -->
| 26      <!-- etch pressure -->
| 0      <!-- C4F8 flow -->
| 275      <!-- SF6 flow -->
| 5      <!-- O2 flow -->
| 2500      <!-- coil power -->
| 35      <!-- platen power -->
! New      <!-- Showerhead -->
| [[Specific Process Knowledge/Etch/DRIE-Pegasus/showerheadchange/ProcessD/NewProcessD | 4]]      <!-- link processes -->
| Large undercut  <!-- keywords -->
|-
! PrD01 <!-- step -->
| 0      <!-- chiller temp -->
| 1      <!-- dep time -->
| 20      <!-- dep pressure -->
| 150      <!-- C4F8 flow -->
| 0      <!-- SF6 flow -->
| 0    <!-- O2 flow -->
| 2000      <!-- coil power -->
! 2.4      <!-- etch time -->
| 26      <!-- etch pressure -->
| 0      <!-- C4F8 flow -->
| 275      <!-- SF6 flow -->
| 5      <!-- O2 flow -->
| 2500      <!-- coil power -->
| 35      <!-- platen power -->
| New      <!-- Showerhead -->
| [[Specific Process Knowledge/Etch/DRIE-Pegasus/showerheadchange/ProcessD/PrD01 | 2]]      <!-- link processes -->
|  <!-- keywords -->
|-
! PrD02 <!-- step -->
| 0      <!-- chiller temp -->
! 1.1      <!-- dep time -->
| 20      <!-- dep pressure -->
| 150      <!-- C4F8 flow -->
| 0      <!-- SF6 flow -->
| 0    <!-- O2 flow -->
| 2000      <!-- coil power -->
| 2.4      <!-- etch time -->
| 26      <!-- etch pressure -->
| 0      <!-- C4F8 flow -->
| 275      <!-- SF6 flow -->
| 5      <!-- O2 flow -->
| 2500      <!-- coil power -->
| 35      <!-- platen power -->
| New      <!-- Showerhead -->
| [[Specific Process Knowledge/Etch/DRIE-Pegasus/showerheadchange/ProcessD/PrD02 | 1]]      <!-- link processes -->
|  <!-- keywords -->
|-
! PrD-3 <!-- step -->
| 0      <!-- chiller temp -->
| 1      <!-- dep time -->
| 20      <!-- dep pressure -->
| 150      <!-- C4F8 flow -->
| 0      <!-- SF6 flow -->
| 0    <!-- O2 flow -->
| 2000      <!-- coil power -->
! 2.5      <!-- etch time -->
| 26      <!-- etch pressure -->
| 0      <!-- C4F8 flow -->
| 275      <!-- SF6 flow -->
| 5      <!-- O2 flow -->
| 2500      <!-- coil power -->
| 35      <!-- platen power -->
| New      <!-- Showerhead -->
| [[Specific Process Knowledge/Etch/DRIE-Pegasus/showerheadchange/ProcessD/PrD-3 | 1]]      <!-- link processes -->
|  <!-- keywords -->
|-
! PrD-4 <!-- step -->
| 0      <!-- chiller temp -->
| 1      <!-- dep time -->
| 20      <!-- dep pressure -->
| 150      <!-- C4F8 flow -->
| 0      <!-- SF6 flow -->
| 0    <!-- O2 flow -->
| 2000      <!-- coil power -->
! 2.2      <!-- etch time -->
| 26      <!-- etch pressure -->
| 0      <!-- C4F8 flow -->
| 275      <!-- SF6 flow -->
| 5      <!-- O2 flow -->
| 2500      <!-- coil power -->
| 35      <!-- platen power -->
| New      <!-- Showerhead -->
| [[Specific Process Knowledge/Etch/DRIE-Pegasus/showerheadchange/ProcessD/PrD-4 | 1]]      <!-- link processes -->
| Best one so far!  <!-- keywords -->
|-
|}
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