Specific Process Knowledge/Lithography/EBeamLithography/JBX9500Manual: Difference between revisions
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''' Mask writing mode (first print) '''<br> | ''' Mask writing mode (first print) '''<br> | ||
With the path DRF5M, which is recommended for first print exposures (mask writing mode), HEIMAP is executed right before the machine starts the exposure and the machine will use the HEIMAP settings saved at this point. | With the path DRF5M, which is recommended for first print exposures (mask writing mode), HEIMAP is executed right before the machine starts the exposure and the machine will use the HEIMAP settings saved at this point. | ||
It is important to measure height over an area that cover the entire pattern to be exposed. Also, make sure not measure height too close to the rim of the cassette (0.5-1 cm depending on cassette) or at substrate positions where the laser beam is deflected from holes or mesas. | |||
The e-beam software can only save and use one pitch-setting, even if you expose two wafers/chips. Therefore, perform and save HEIMAP with the settings you wish to perform right before exposure. | The e-beam software can only save and use one pitch-setting, even if you expose two wafers/chips. Therefore, perform and save HEIMAP with the settings you wish to perform right before exposure. | ||
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