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Specific Process Knowledge/Bonding: Difference between revisions

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*Anodic bonding
*Anodic bonding


===Comparing the three bonding methods===
===Comparing the three bonding methods in the EVG NIL===
{| border="2" cellspacing="0" cellpadding="4" align="center"
{| border="2" cellspacing="0" cellpadding="4" align="center"
!.
!.
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|Up to 6"
|Up to 6"
|-valign="top"
|-valign="top"
|'''Resolution z'''
|'''Cleaning'''
|1Å or 25Å
|Cleaning by N2.
|1Å, 10Å or 20Å
|Wet chemical cleaning, IMEC.
|<1Å - accuracy better than 2%
|Cleaning by N2.
|- valign="top"
|'''Max. scan depth [µm] (as a function of trench width W''')
|0.87(W[µm]-5µm)
|1.2(W[µm]-5µm)
|~1 with standard cantilever.
|-valign="top"
|'''Tip radius'''
|5 µm 60<sup>o</sup> cone
|5 µm 45<sup>o</sup> cone
|<12 nm on standard cantilever
|-valign="top"
|'''Stress measurement'''
|Can be done
|Can be done
|Cannot be done
|-valign="top"
|'''Surface roughness'''
|Can be done on a line scan
|Can be done on a line scan
|Can be done on a selected surface area
|-  
|-  
|}
|}
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