Specific Process Knowledge/Bonding: Difference between revisions
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|'''General description''' | |'''General description''' | ||
|For bonding an interphase that makes an eutecticum | |For bonding two substrates by use of an interphase that makes an eutecticum. | ||
|For bonding two identical materials | |For bonding two identical materials. | ||
|For bonding Si and Glass. | |For bonding Si and Glass. | ||
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|'''Materials possible to bond''' | |'''Materials possible to bond''' | ||
|Au/Si , Au/Sn | |Bonding of primarely Si is done by use of the eutectica Au/Si, Au/Sn and Ni/Si | ||
|Si/Si, SiO<math>_2</math>/SiO<math>_2</math> | |Si/Si, SiO<math>_2</math>/SiO<math>_2</math> | ||
|Si/Pyrex (glass) | |Si/Pyrex (glass) | ||