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Specific Process Knowledge/Etch/DRIE-Pegasus/nanoetch: Difference between revisions

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Jmli (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
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The recipes below have been run on 2" wafers with 30/60/90/120/150 nm lines in zep resist. The wafers were crystalbonded to a 4" oxide carrier leaving only a very small fraction (much less than 1% )of silicon to be etched. The most used one is the nano1.42 recipe - to access the results, click on the bold link in the bottom of the table.
The recipes below have been run on 2" wafers with 30/60/90/120/150 nm lines in zep resist. The wafers were crystalbonded to a 4" oxide carrier leaving only a very small fraction (much less than 1% )of silicon to be etched. The most used one is the nano1.42 recipe - to access the results, click on the bold link in the bottom of the table.


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