Specific Process Knowledge/Thin film deposition/ALD Picosun R200/ALD multilayers: Difference between revisions
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[[:File:Al2O3_TiO2_flat_multilayers.jpg]] | [[:File:Al2O3_TiO2_flat_multilayers.jpg]] | ||
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<b>Evgeniy Shkondin, DTU Danchip, 2014-2016.</b> | |||
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===Investigation of chemical composition in multilayers system=== | |||
Chemical taice analysis has been performed using [[Specific_Process_Knowledge/Characterization/XPS#XPS-ThermoScientific|XPS-ThermoScientific]] equipment in depth profile mode. | |||
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image:XPS_depth_multi_survey.JPG| Survey scan. | |||
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<gallery caption="" widths="300px" heights="300px" perrow="4"> | |||
image:XPS_depth_Al_10_Al.jpg| Al 2p signal multilayers. | |||
image:XPS_depth_Al_10_Ti.jpg| Ti 2p signal multilayers. | |||
image:XPS_depth_Al_10_O.jpg| O 1s signal multilayers. | |||
image:XPS_depth_Al_10_Si.jpg| Si 2p signal multilayers. | |||
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<b>Evgeniy Shkondin, DTU Danchip, 2014-2016.</b> | <b>Evgeniy Shkondin, DTU Danchip, 2014-2016.</b> | ||