Specific Process Knowledge/Thin film deposition/ALD Picosun R200/ALD multilayers: Difference between revisions
| Line 31: | Line 31: | ||
==Low temperature deposition of TiO<sub>2</sub>== | ==Low temperature deposition of TiO<sub>2</sub>== | ||
<b>Recipe: | <b>Recipe: TiO2 LT</b> | ||
<b>Temperature: 80-150 <sup>o</sup>C</b> | <b>Temperature: 80-150 <sup>o</sup>C</b> | ||
Revision as of 15:31, 19 May 2016
This page describes non standart recipes including multilayers structures.
Low temperature deposition of Al2O3
Recipe: Al2O3LT
Temperature:80-150 oC
| TMA | H2O | |
|---|---|---|
| Nitrogen flow | 150 sccm | 200 sccm |
| Pulse time | 0.1 s | 0.1 s |
| Purge time | 3.0 s | 4.0 s |
Deposition rate: 0.085-0.097 nm/cycle (temperature dependent)
Low temperature deposition of TiO2
Recipe: TiO2 LT
Temperature: 80-150 oC
| TiCl4 | H2O | |
|---|---|---|
| Nitrogen flow | 150 sccm | 200 sccm |
| Pulse time | 0.2 s | 0.2 s |
| Purge time | 10.0 s | 15.0 s |
Deposition rate: 0.048 nm/cycle (@ 120 oC)
Low temperature grown multilayers on flat surfaces
Recipe: EMA01
Recipe: EMA02
Recipe: EMA03
Recipe: EMA04
Temperature: 120 oC
Al2O3/TiO2 multilayers on high aspect ratio structures
Recipe: Multi T
Temperature: 150 oC