Specific Process Knowledge/Back-end processing/Disco Saw: Difference between revisions
No edit summary |
No edit summary |
||
| Line 62: | Line 62: | ||
<br clear="all" /> | <br clear="all" /> | ||
==Comparing dicing parameters for different materials== | ===Comparing dicing parameters for different materials=== | ||
{| border="2" cellspacing="0" cellpadding="4" align="center" | {| border="2" cellspacing="0" cellpadding="4" align="center" | ||
| Line 103: | Line 103: | ||
|} | |} | ||
===Images of diced samples=== | |||
[[Image:Dicetest_001.jpg|300x300px|thumb|Si V-groove diced with ZH05 blade |left]] | [[Image:Dicetest_001.jpg|300x300px|thumb|Si V-groove diced with ZH05 blade |left]] | ||