Specific Process Knowledge/Wafer cleaning/RCA: Difference between revisions

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==RCA cleaning==
==RCA cleaning==
[[Image:RCA_bench_cleanroom_2.jpg|300x300px|thumb|RCA bench: positioned in cleanroom 2. <br /> RCA1 - RCA2 - HF - BHF(pre-dep wafers)]
[[Image:RCA_bench_cleanroom_2.jpg|300x300px|thumb|RCA bench: positioned in cleanroom 2. <br /> RCA1 - RCA2 - HF - BHF(pre-dep wafers)]]


The RCA clean is used for cleaning the wafers before taking them into the furnaces and a few other equipments (check the cross contamination sheet).
The RCA clean is used for cleaning the wafers before taking them into the furnaces and a few other equipments (check the cross contamination sheet).

Revision as of 11:39, 6 March 2008

RCA cleaning

RCA bench: positioned in cleanroom 2.
RCA1 - RCA2 - HF - BHF(pre-dep wafers)

The RCA clean is used for cleaning the wafers before taking them into the furnaces and a few other equipments (check the cross contamination sheet). It consists of two solutions: RCA1 and RCA2 plus diluted HF. A crucial part of the RCA clean is the oxidation by HFailed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle _2} OFailed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle _2} . Therefore the life time of the RCA solutions are limited by the presence of the HFailed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle _2} OFailed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle _2} which is highly volatile at 70 oC.

  • The RCA1 contains: HFailed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle _2} O, NHFailed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle _4} OH and HFailed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle _2} OFailed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle _2} (5:1:1). It is used for removal of light organics, particles and metals.
  • The RCA2 contains: HFailed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle _2} O, HCl and HFailed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle _2} OFailed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle _2} (5:1:1). It is used for removal of alkalis, metal hydroxides, and residual metals.

RCA procedure

  • RCA1: 10 min
  • DI water rinsing (dumping three times)
  • HF: 30 sec (avoid it if you have oxide as the top layer)
  • DI water rinsing (dumping three times)
  • RCA2: 10 min
  • DI water rinsing (dumping three times)
  • Optional: HF: 30 sec (avoid it if you have oxide as the top layer)
  • DI water rinsing (dumping three times)

For procedure details please look in the user manual positioned in LabManager.

Overview of RCA process data

RCA1 RCA2 HF
General description

Used for removal of light organics, particles and desorption of trace metals (Au, Ag, Ni, Cd, Zn, Co, Cr, etc).

Used for removal of alkali ions, metal hydroxides (of Al, Fe, Mg, Zn) and residual trace metals (e.g. Cu and Au).

Used for removal of oxide generated in RCA1 and RCA2

Chemical solution HFailed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle _2} O, NHFailed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle _4} OH(29%) and HFailed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle _2} OFailed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle _2} (30%) (5:1:1) HFailed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle _2} O, HCl(37%) and HFailed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle _2} OFailed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle _2} (30%) (5:1:1) 5% HF
Process temperature 70-80 oC 70-80 oC Room temperature
Process time

10 min.

10 min.

30 sec.

Life time of the chemical solutions Can only be heated one time. When hot: it lasts for ~1h Can only be heated one time. When hot: it lasts for ~1h ~2 months
Allowed materials
  • Silicon
  • Silicon oxide
  • Silicon nitride
  • Quartz wafers/fused silica
  • Silicon
  • Silicon oxide
  • Silicon nitride
  • Quartz wafers/fused silica
  • Silicon
  • Silicon oxide
  • Silicon nitride
Batch size

1-25 2",4" or 6" wafers at a time

1-25 2",4" or 6" wafers at a time

1-25 2",4" or 6" wafers at a time

Size of substrate

4"-6" wafers
For 2" wafers please contact Danchip staff

4"-6" wafers
For 2" wafers please contact Danchip staff

4"-6" wafers
For 2" wafers please contact Danchip staff