Specific Process Knowledge/Wafer cleaning/RCA: Difference between revisions
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*The RCA1 contains: H<math>_2</math>O, NH<math>_4</math>OH and H<math>_2</math>O<math>_2</math> (5:1:1). It is used for removal of light organics, particles and metals. <br \> | *The RCA1 contains: H<math>_2</math>O, NH<math>_4</math>OH and H<math>_2</math>O<math>_2</math> (5:1:1). It is used for removal of light organics, particles and metals. <br \> | ||
*The RCA2 contains: H<math>_2</math>O, HCl and H<math>_2</math>O<math>_2</math> (5:1:1). It is used for removal of | *The RCA2 contains: H<math>_2</math>O, HCl and H<math>_2</math>O<math>_2</math> (5:1:1). It is used for removal of alkalis, metal hydroxides, and residual metals. | ||
===RCA procedure=== | ===RCA procedure=== | ||