Specific Process Knowledge/Wafer cleaning/RCA: Difference between revisions
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Used for removal of alkali ions, metal hydroxides (of Al, Fe, Mg, Zn) and residual trace metals (e.g. Cu and Au). | Used for removal of alkali ions, metal hydroxides (of Al, Fe, Mg, Zn) and residual trace metals (e.g. Cu and Au). | ||
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Used for removal of oxide generated in RCA1 and RCA2 | |||
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|'''Chemical solution''' | |'''Chemical solution''' | ||