Specific Process Knowledge/Lithography/DUVStepperLithography: Difference between revisions
| Line 16: | Line 16: | ||
*[[/Optimization and Simulation|Optimization and Simulation]] | *[[/Optimization and Simulation|Optimization and Simulation]] | ||
*[[/Reticle Design|Reticle Design]] | *[[/Reticle Design|Reticle Design]] | ||
*[[/Process Flow|Process Flow]] | |||
*The SÜSS Spinner-Stepper is dedicated for spinning DUV resists. Please note that a Bottom Anti-Reflective Coating (BARC) is necessary to guarantee high quality of both the resist film and the exposure. Please find the specification of the SÜSS Spinner-Stepper in the LabAdviser [[http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/DUVStepperLithography#SÜSS Spinner-Stepper]]. | *The SÜSS Spinner-Stepper is dedicated for spinning DUV resists. Please note that a Bottom Anti-Reflective Coating (BARC) is necessary to guarantee high quality of both the resist film and the exposure. Please find the specification of the SÜSS Spinner-Stepper in the LabAdviser [[http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/DUVStepperLithography#SÜSS Spinner-Stepper]]. | ||