Revision as of 11:59, 2 May 2016

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The user manuals, quality control procedures and results, user APVs, technical information and contact information can be found in LabManager:

SEM's at DTU Danchip:

Equipment performance and process related parameters

Equipment		SEM Supra 2 (Supra 60VP SEM)
Purpose	Imaging and measurement of	Any sample except bulk insulators such as polymers, glass or quartz wafers
Location		Cleanroom of DTU Danchip
Performance	Resolution	1-2 nm (limited by vibrations) The resolution is strongly dependent on the type of sample and the skills of the operator.
Instrument specifics	Detectors	Secondary electron (Se2) Inlens secondary electron (Inlens) 4 Quadrant Backscatter electron (QBSD) Variable pressure secondary electron (VPSE)
	Stage	X, Y: 150 × 150 mm T: -10 to 70^o R: 360^o Z: 50 mm
	Electron source	FEG (Field Emission Gun) source
	Operating pressures	Fixed at High vacuum (2 × 10^-4mbar - 10^-6mbar) Variable at Low vacuum (0.1 mbar - 2 mbar)
	Options	Antivibration platform Fjeld M-200 airlock taking up to 8" wafers Oxford Instruments X-Max^N 50 mm² SDD EDX detector and AZtec software package
Substrates	Batch size	Up to 8" wafer with 6" view
	Allowed materials	Any standard cleanroom material

@@ Line 18: / Line 18: @@
 !colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment
-|style="background:WhiteSmoke; color:black"|<b>SEM Supra 1 (Supra 40VP SEM)</b>
+|style="background:WhiteSmoke; color:black"|<b>SEM Supra 2 (Supra 60VP SEM)</b>
 |-
 !style="background:silver; color:black" align="center" valign="center" rowspan="1"|Purpose
@@ Line 28: / Line 28: @@
 |style="background:LightGrey; color:black"|
 |style="background:WhiteSmoke; color:black"|
-*Basement of DTU Danchip
+*Cleanroom of DTU Danchip
 |-
 !style="background:silver; color:black;" align="center" width="60"|Performance
@@ Line 46: / Line 46: @@
 |style="background:LightGrey; color:black"|Stage
 |style="background:WhiteSmoke; color:black"|
-*X, Y: 130 &times; 130 mm
+*X, Y: 150 &times; 150 mm
-*T: -4 to 70<sup>o</sup>
+*T: -10 to 70<sup>o</sup>
 *R: 360<sup>o</sup>
 *Z: 50 mm
@@ Line 62: / Line 62: @@
 |style="background:LightGrey; color:black"|Options
 |style="background:WhiteSmoke; color:black"|
-*All software options available
+*Antivibration platform
+*Fjeld M-200 airlock taking up to 8" wafers
+*Oxford Instruments X-Max<sup>N</sup> 50 mm<sup>2</sup> SDD EDX detector and AZtec software package
 |-
 !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
 |style="background:LightGrey; color:black"|Batch size
 |style="background:WhiteSmoke; color:black"|
-*Up to 6" wafer with full view
+*Up to 8" wafer with 6" view
 |-
 | style="background:LightGrey; color:black"|Allowed materials
 |style="background:WhiteSmoke; color:black"|
-*Any standard cleanroom material and samples from the Laser Micromachining tool and the Polymer Injection Molding tool
+*Any standard cleanroom material
 |-
 |}