Specific Process Knowledge/Characterization/SEM Supra 2: Difference between revisions

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 !colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment
-|style="background:WhiteSmoke; color:black"|<b>SEM Supra 1 (Supra 40VP SEM)</b>
+|style="background:WhiteSmoke; color:black"|<b>SEM Supra 2 (Supra 60VP SEM)</b>
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 !style="background:silver; color:black" align="center" valign="center" rowspan="1"|Purpose
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 |style="background:WhiteSmoke; color:black"|
-*Basement of DTU Danchip
+*Cleanroom of DTU Danchip
 |-
 !style="background:silver; color:black;" align="center" width="60"|Performance
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 |style="background:LightGrey; color:black"|Stage
 |style="background:WhiteSmoke; color:black"|
-*X, Y: 130 &times; 130 mm
+*X, Y: 150 &times; 150 mm
-*T: -4 to 70<sup>o</sup>
+*T: -10 to 70<sup>o</sup>
 *R: 360<sup>o</sup>
 *Z: 50 mm
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 |style="background:LightGrey; color:black"|Options
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-*All software options available
+*Antivibration platform
+*Fjeld M-200 airlock taking up to 8" wafers
+*Oxford Instruments X-Max<sup>N</sup> 50 mm<sup>2</sup> SDD EDX detector and AZtec software package
 |-
 !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
 |style="background:LightGrey; color:black"|Batch size
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-*Up to 6" wafer with full view
+*Up to 8" wafer with 6" view
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 | style="background:LightGrey; color:black"|Allowed materials
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-*Any standard cleanroom material and samples from the Laser Micromachining tool and the Polymer Injection Molding tool
+*Any standard cleanroom material
 |-
 |}