Specific Process Knowledge/Characterization/SEM Supra 2: Difference between revisions

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* [http://www.labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=327| The SEM Supra 2 page in LabManager],  
* [http://www.labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=327| The SEM Supra 2 page in LabManager],  
* [http://www.labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=361| The SEM Supra 3 page in LabManager],
* [http://www.labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=361| The SEM Supra 3 page in LabManager],
==Equipment performance and process related parameters==
{| border="2" cellspacing="0" cellpadding="2"
!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment
|style="background:WhiteSmoke; color:black"|<b>SEM Supra 1 (Supra 40VP SEM)</b>
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="1"|Purpose
|style="background:LightGrey; color:black"|Imaging and measurement of
|style="background:WhiteSmoke; color:black"|
*Any sample except bulk insulators such as polymers, glass or quartz wafers
|-
!style="background:silver; color:black;" align="center" width="60"|Location
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
*Basement of DTU Danchip
|-
!style="background:silver; color:black;" align="center" width="60"|Performance
|style="background:LightGrey; color:black"|Resolution
|style="background:WhiteSmoke; color:black"|
*1-2 nm (limited by vibrations)
The resolution is strongly dependent on the type of sample and the skills of the operator.
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="5"|Instrument specifics
|style="background:LightGrey; color:black"|Detectors
|style="background:WhiteSmoke; color:black"|
*Secondary electron (Se2)
*Inlens secondary electron (Inlens)
*4 Quadrant Backscatter electron (QBSD)
*Variable pressure secondary electron (VPSE)
|-
|style="background:LightGrey; color:black"|Stage
|style="background:WhiteSmoke; color:black"|
*X, Y: 130 &times; 130 mm
*T: -4 to 70<sup>o</sup>
*R: 360<sup>o</sup>
*Z: 50 mm
|-
|style="background:LightGrey; color:black"|Electron source
|style="background:WhiteSmoke; color:black"|
*FEG (Field Emission Gun) source
|-
|style="background:LightGrey; color:black"|Operating pressures
|style="background:WhiteSmoke; color:black"|
*Fixed at High vacuum (2 &times; 10<sup>-4</sup>mbar - 10<sup>-6</sup>mbar)
*Variable at Low vacuum (0.1 mbar - 2 mbar)
|-
|style="background:LightGrey; color:black"|Options
|style="background:WhiteSmoke; color:black"|
*All software options available
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Batch size
|style="background:WhiteSmoke; color:black"|
*Up to 6" wafer with full view
|-
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black"|
*Any standard cleanroom material and samples from the Laser Micromachining tool and the Polymer Injection Molding tool
|-
|}

Revision as of 11:55, 2 May 2016

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The user manuals, quality control procedures and results, user APVs, technical information and contact information can be found in LabManager:

SEM's at DTU Danchip:


Equipment performance and process related parameters

Equipment SEM Supra 1 (Supra 40VP SEM)
Purpose Imaging and measurement of
  • Any sample except bulk insulators such as polymers, glass or quartz wafers
Location
  • Basement of DTU Danchip
Performance Resolution
  • 1-2 nm (limited by vibrations)

The resolution is strongly dependent on the type of sample and the skills of the operator.

Instrument specifics Detectors
  • Secondary electron (Se2)
  • Inlens secondary electron (Inlens)
  • 4 Quadrant Backscatter electron (QBSD)
  • Variable pressure secondary electron (VPSE)
Stage
  • X, Y: 130 × 130 mm
  • T: -4 to 70o
  • R: 360o
  • Z: 50 mm
Electron source
  • FEG (Field Emission Gun) source
Operating pressures
  • Fixed at High vacuum (2 × 10-4mbar - 10-6mbar)
  • Variable at Low vacuum (0.1 mbar - 2 mbar)
Options
  • All software options available
Substrates Batch size
  • Up to 6" wafer with full view
Allowed materials
  • Any standard cleanroom material and samples from the Laser Micromachining tool and the Polymer Injection Molding tool
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