Specific Process Knowledge/Lithography/SU-8: Difference between revisions
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* Controlled soft and post-exposure bakes are recommended and must be optimized for the specific application, but baseline parameters which can be used as a starting point will be given. | * Controlled soft and post-exposure bakes are recommended and must be optimized for the specific application, but baseline parameters which can be used as a starting point will be given. | ||
You can also take a look at a Ph.D thesis on the topic that you can find in Process2Share: http://process2share.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Photolithography/SU8#Reports] | |||
==Pretreatment== | ==Pretreatment== | ||
* To dehydrate the surface, bake in 250C oven at least 30 min, the longer the bake the better. Baking overnight is recommended. | * To dehydrate the surface, bake in 250C oven at least 30 min, the longer the bake the better. Baking overnight is recommended. | ||