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Specific Process Knowledge/Back-end processing/Laser Micromachining Tool: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891, Bureaucrats, danchip, Administrators
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Jehan (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891, Bureaucrats, danchip, Administrators
1,093 edits
Line 109: Line 109:
* 1064nm : 80W
* 1064nm : 80W
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|-
!style="background:silver; color:black" align="left" valign="top" rowspan="1"|Substrates
!style="background:silver; color:black" align="left" valign="top" rowspan="2"|Substrates
|style="background:LightGrey; color:black"|Material allowed  
|style="background:LightGrey; color:black"|Material allowed  
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
Line 121: Line 121:
* Topas
* Topas
* Nickel
* Nickel
 
|-
|style="background:LightGrey; color:black"|Material NOT allowed
|style="background:WhiteSmoke; color:black"|
* PTFE (teflon)
|-
|-
!style="background:silver; color:black" align="left" valign="top" rowspan="1"|Parameters
!style="background:silver; color:black" align="left" valign="top" rowspan="1"|Parameters
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