Specific Process Knowledge/Etch/RIE (Reactive Ion Etch): Difference between revisions
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*Silicon oxide or silicon (oxy)nitride | *Silicon oxide or silicon (oxy)nitride | ||
*Aluminium | *Aluminium | ||
*Other metals if the coverage is <5% of the wafer area (ONLY | *Other metals if the coverage is <5% of the wafer area (ONLY RIE2!) | ||
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