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Specific Process Knowledge/Lithography/EBeamLithography: Difference between revisions

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|Negative
|Negative
|DOW Corning
|DOW Corning
|Approved. Standard negative resist, mainly for III-V materials
|Approved. Standard negative resist
|[[media:File:DowCorningHSQA.pdf|HSQ Dow Corning]], [[media:File:MSDS HSQ.pdf|MSDS HSQ]]  
|[[media:DowCorningHSQA.pdf|HSQ Dow Corning]], [[media:MSDS HSQ.pdf|MSDS HSQ]]  
|See table <u>[[Specific_Process_Knowledge/Lithography/Coaters#Coaters:_Comparison_Table|here]] </u>
|See table <u>[[Specific_Process_Knowledge/Lithography/Coaters#Coaters:_Comparison_Table|here]] </u>
|
|
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|H2O
|H2O
|
|
|[[media:File:Process Flow HSQ.docx|process flow HSQ]]
|[[media:Process Flow HSQ.docx|process flow HSQ]]


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