Specific Process Knowledge/Lithography/EBeamLithography: Difference between revisions
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|DOW Corning | |DOW Corning | ||
|Approved. Standard negative resist, mainly for III-V materials | |Approved. Standard negative resist, mainly for III-V materials | ||
|[[media:File:DowCorningHSQA.pdf|HSQ Dow Corning]] [[media:File:MSDS HSQ.pdf| MSDS HSQ]] | |[[media:File:DowCorningHSQA.pdf|HSQ Dow Corning]] [[media:File:MSDS HSQ.pdf|MSDS HSQ]] | ||
|See table <u>[[Specific_Process_Knowledge/Lithography/Coaters#Coaters:_Comparison_Table|here]] </u> | |See table <u>[[Specific_Process_Knowledge/Lithography/Coaters#Coaters:_Comparison_Table|here]] </u> | ||
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|H2O | |H2O | ||
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|[[media:File:Process Flow HSQ.docx| process flow HSQ]] | |[[media:File:Process Flow HSQ.docx|process flow HSQ]] | ||
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